IEEE Transactions on Very Large Scale Integration (VLSI) Systems: Vol. 21, No. 3, March 2013

S.-H. Chen, Y.-L. Lin, Et.all

Informasi Dasar

R.2125
620.001 1
Jurnal Internasional - Reference
R2
  1. Power-Up Sequence Control for MTCMOS Designs / S.-H. Chen, Y.-L. Lin, M.C.-T. Chao

  2. Architecture and Design Flow for a Highly Efficient Structured ASIC / M.-H. Ho, et al.

  3. Secure Dual-Core Cryptoprocessor for Pairings Over Barreto-Naehrig Curves on FPGA Platform / S. Ghosh, D. Mukhopadhay, D. Roychowdhury

  4. In-Situ Method for TSV Delay Testing and Characterization Using Input Sensitivity Analysis / J.-W. You, et al.

  5. Low-Resolution DAC-Driven Linearity Testing of Higher Resolution ADCs Using Polynomial Fitting Measurements / S. Kook, H.W. Choi, A. Chatterjee

  6. Low Cost Error Tolerance Scheme for 3-D CMOS Imagers / H.-M. Chang, et al.

  7. Computing Two-Pattern Test Cubes for Transition Path Delay Faults / I Pomeranz

  8. Integated Energy-Harvesting Photodiodes with Diffractive Storage Capacitance / E.G. Fong, et al.

  9. IR Drop in On-Chip Power Distribution Networks of ICs with Nonuniform Power Consuption / J. Rius, et al.

  10. Fast Fixed-Outline 3-D IC Floorplanning with TSV CoPlacement / C.-R. Lo W.-K. Mak, T.C. Wang.

Etc.

Subjek

Computer systems
Very Large Scale Integration (VLSI) Systems

Katalog

IEEE Transactions on Very Large Scale Integration (VLSI) Systems: Vol. 21, No. 3, March 2013
ISSN: 1063-8210
208p.: il.; 28cm
Inggris

Sirkulasi

Rp. 0
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Tidak

Pengarang

S.-H. Chen, Y.-L. Lin, Et.all
Perorangan
Yehea Ismail
 

Penerbit

IEEE (Institute of Electrical and Electronics Engineers)
New Jersey
2013

Koleksi

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