Advances in Embedded and Fan-Out Wafer Level Packaging Technologies

Steffen Kroehnert

Informasi Dasar

51 kali
23.21.298
621.395
Buku - Elektronik (E-Book)
Tel-U Gedung Manterawu Lantai 5 : Rak 13b
Tel-U Purwokerto : Rak 6

Examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges Embedded and fan-out wafer level packaging (FO-WLP) technologies have been developed across the industry over the past 15 years and have been in high volume manufac...

Subjek

Circuits
 

Katalog

Advances in Embedded and Fan-Out Wafer Level Packaging Technologies
9781119314134
576p.: pdf file.; 7.5 MB
English

Sirkulasi

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Pengarang

Steffen Kroehnert
Perorangan
 
 

Penerbit

Wiley-IEEE Press
New York
2019

Koleksi

Kompetensi

 

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