This book consolidates much of the past 15years’ activity within this amazing new field of packaging technology, starting with a “History of Embedded and Fan?Out Packaging Technology” by Michael Töpper et al. of Fraunhofer
IZM, followed by “FO?WLP Market and Technology Trends” by E. Jan
Vardaman of TechSearch International. Sections are dedicated to chip?first
FO?WLP, chip?last FO?WLP, embedded die packaging, material challenges,
equipment challenges, and resulting technology fusions.
The chip?first FO?WLP section begins with a chapter on the first chip?first
FO?WLP in the market, called eWLB, by Thorsten Meyer of Infineon
Technologies and our coeditor Steffen Kroehnert of Amkor Technology
Holding B.V. The section continues with the extension of eWLB to package?
on?package (PoP) solutions by S. W. Yoon of STATS ChipPAC. Further chip?
first FO?WLP chapters include nepes Corporation’s fan?out packaging
technology by Jay Kim and Deca Technologies’ M?Series™ technology by Tim
Olson et al. A new technology called chip?last, represented by Amkor
Technology’s silicon wafer integrated fan?out technology (SWIFT®), is then
presented by Ron Huemoeller and Curtis Zwenger
The embedded die packaging section describes the embedding of die using
printed circuit board processes and materials technology represented by
Schweizer Electronic (i2 Board and p2 Pack) in chapters by Thomas Gottwald
et al., J?Devices (fan?out panel?level package [FO?PLP]) by Akio Katsumata
et al., and Infineon Technologies (Blade) by Boris Plikat and Thorsten Scharf.
This section also includes a novel idea of embedding a die in a silicon wafer by
Daquan Yu of Huatian Technology Electronics Co.