Heterogeneous Integrations

John H. Lau

Informasi Dasar

21.21.382
621.31
Buku - Elektronik (E-Book)

Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems. The book offers a valuable asset for researchers, engineers, and graduate students in the fields of semiconductor packaging, materials sciences, mechanical engineering, electronic engineering, telecommunications, networking, etc.

Subjek

ELECTRIC ENGINEERING
Telecommunication, Mechanical Engineering

Katalog

Heterogeneous Integrations
978-981-13-7224-7
381p.: pdf file.; 24,5 MB
Inggris

Sirkulasi

Rp. 0
Rp. 0
Tidak

Pengarang

John H. Lau
Perorangan
 
 

Penerbit

Springer Singapore
 
2019

Koleksi

Kompetensi

  • TTH3I3 - ELEKTRONIKA TELEKOMUNIKASI

Download / Flippingbook

 

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