Modeling and Application of Flexible Electronics Packaging

YongAn Huang, Zhouping Yin, Xiaodong Wan

Informasi Dasar

57 kali
21.21.319
621.381
Buku - Elektronik (E-Book)
Tel-U Gedung Manterawu Lantai 5 : Rak 12b
Tel-U Purwokerto : Rak 6

This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of the equipment to help readers easily learn how to use it. This book is a valuable resource for scholars and graduate students in the research field of microelectronics.

Subjek

ELECTRONIC
Printing

Katalog

Modeling and Application of Flexible Electronics Packaging
978-981-13-3627-0
297p.: pdf file.; 15 MB
Inggris

Sirkulasi

Rp. 0
Rp. 0
Tidak

Pengarang

YongAn Huang, Zhouping Yin, Xiaodong Wan
Perorangan
 
 

Penerbit

Springer Singapore
 
2019

Koleksi

Kompetensi

 

Download / Flippingbook

 

Ulasan

Belum ada ulasan yang diberikan
anda harus sign-in untuk memberikan ulasan ke katalog ini