Advances in Embedded and Fan-Out Wafer Level Packaging Technologies

Koleksi

Katalog

Advances in Embedded and Fan-Out Wafer Level Packaging Technologies
21.21.2041 - Beth Keser, Steffen Kroehnert

Barcode

21.21.2041-1

Kondisi

Tersedia

Tanggal masuk

16 July 2021

Unit

Asal penerimaan

Sumbangan

Pemasok

Logistik Telkom University

Harga pembelian

Jenis katalog

Buku - Elektronik (E-Book)

Lokasi

Tel-U Gedung Manterawu Lantai 5