Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments

Juan Cepeda-Rizo, Jeremiah Gayle, Joshua Ravich

Informasi Dasar

71 kali
24.21.036
621.4021
Buku - Elektronik (E-Book)
Tel-U Gedung Manterawu Lantai 5 : Rak 13b
Tel-U Purwokerto : Rak 6

Have you ever wondered how NASA designs, builds, and tests spacecrafts and hardware for space? How is it that wildly successful programs such as the Mars Exploration Rovers could produce a rover that lasted over ten times the expected prime mission duration? Or build a spacecraft designed to visit two orbiting destinations and last over 10 years when the fuel ran out? This book was written by NASA/JPL engineers with experience across multiple projects, including the Mars rovers, Mars helicopter, and Dawn ion propulsion spacecraft in addition to many more missions and technology demonstration programs. It provides useful and practical approaches to solving the most complex thermal-structural problems ever attempted for design spacecraft to survive the severe cold of deep space, as well as the unforgiving temperature swings on the surface of Mars. This is done without losing sight of the fundamental and classical theories of thermodynamics and structural mechanics that paved the way to more pragmatic and applied methods such finite element analysis and Monte Carlo ray tracing, for example.

Subjek

HEAT ENGINEERING
 

Katalog

Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments
9781032160818
342p.: pdf file.; 8 MB
English

Sirkulasi

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Pengarang

Juan Cepeda-Rizo, Jeremiah Gayle, Joshua Ravich
Perorangan
 
 

Penerbit

CRC Press
Boca Raton
2021

Koleksi

Kompetensi

 

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