Wireless Interface Technologies for 3D IC and Module Integration

Tadahiro Kuroda, Wei-Yeung Yip

Informasi Dasar

75 kali
22.21.664
621.384
Buku - Elektronik (E-Book)
Tel-U Gedung Manterawu Lantai 5 : Rak 13a
Tel-U Purwokerto : Rak 6

Synthesising fifteen years of research, this authoritative text provides a comprehensive treatment of two major technologies for wireless chip and module interface design, covering technology fundamentals, design considerations and tradeoffs, practical implementation considerations, and discussion of practical applications in neural network, reconfigurable processors, and stacked SRAM. It explains the design principles and applications of two near-field wireless interface technologies for 2.5-3D IC and module integration respectively, and describes system-level performance benefits, making this an essential resource for researchers, professional engineers and graduate students performing research in next-generation wireless chip and module interface design.

Subjek

WIRELESS COMMUNICATION
 

Katalog

Wireless Interface Technologies for 3D IC and Module Integration
978-1108841214
337p.: pdf file.; 21 MB
English

Sirkulasi

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Pengarang

Tadahiro Kuroda, Wei-Yeung Yip
Perorangan
 
 

Penerbit

Cambridge University Press
New York
2021

Koleksi

Kompetensi

 

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