Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments

Koleksi

Katalog

Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments
24.21.036 - Juan Cepeda-Rizo, Jeremiah Gayle, Joshua Ravich

Barcode

24.21.036-1

Kondisi

Tersedia

Tanggal masuk

03 January 2024

Unit

Asal penerimaan

Beli

Pemasok

Telkom University Open Library

Harga pembelian

Jenis katalog

Buku - Elektronik (E-Book)

Lokasi

Tel-U Gedung Manterawu Lantai 5