Semiconductor Packaging: Materials Interaction and Reliability
Andrea Chen, Randy Hsiao-Yu Lo
Informasi Umum
Kode
25.21.125
Klasifikasi
621.381 - Electronics, microelectronics
Jenis
Buku - Elektronik (E-Book)
Subjek
Microelectronics
No. Rak
Tel-U Gedung Manterawu Lantai 5 : Rak 12b
Tel-U Purwokerto : Rak 6
Dilihat
22 kali
Informasi Lainnya
Abstraksi
In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.
Koleksi & Sirkulasi
Tersedia 1 dari total 1 Koleksi
Anda harus log in untuk mengakses flippingbook
Pengarang
| Nama | Andrea Chen, Randy Hsiao-Yu Lo |
| Jenis | Perorangan |
| Penyunting | |
| Penerjemah |
Penerbit
| Nama | Taylor & Francis |
| Kota | New York |
| Tahun | 2016 |
Sirkulasi
| Harga sewa | IDR 0,00 |
| Denda harian | IDR 0,00 |
| Jenis | Non-Sirkulasi |
