Advances in Embedded and Fan-Out Wafer Level Packaging Technologies

Steffen Kroehnert

Informasi Umum

Kode

23.21.298

Klasifikasi

621.395 - Circuitry, Logic circuits, Logic design circuits, Very large scale integration (VLSI)

Jenis

Buku - Elektronik (E-Book)

Subjek

Circuits

No. Rak

Tel-U Bandung - Gedung Manterawu Lantai 5 : Rak 13b
Tel-U Purwokerto : Rak 6

Dilihat

114 kali

Informasi Lainnya

Abstraksi

Examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges Embedded and fan-out wafer level packaging (FO-WLP) technologies have been developed across the industry over the past 15 years and have been in high volume manufac...