Wireless Interface Technologies for 3D IC and Module Integration
Tadahiro Kuroda, Wei-Yeung Yip
Informasi Umum
Kode
22.21.664
Klasifikasi
621.384 - Radio and Radar, Broadcasting stations, Engineering works on radio and television, on Wireless Communication
Jenis
Buku - Elektronik (E-Book)
Subjek
Wireless Communication
No. Rak
13a
Dilihat
15 kali
Informasi Lainnya
Abstraksi
Synthesising fifteen years of research, this authoritative text provides a comprehensive treatment of two major technologies for wireless chip and module interface design, covering technology fundamentals, design considerations and tradeoffs, practical implementation considerations, and discussion of practical applications in neural network, reconfigurable processors, and stacked SRAM. It explains the design principles and applications of two near-field wireless interface technologies for 2.5-3D IC and module integration respectively, and describes system-level performance benefits, making this an essential resource for researchers, professional engineers and graduate students performing research in next-generation wireless chip and module interface design.
Koleksi & Sirkulasi
Tersedia 1 dari total 1 Koleksi
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Pengarang
| Nama | Tadahiro Kuroda, Wei-Yeung Yip |
| Jenis | Perorangan |
| Penyunting | |
| Penerjemah |
Penerbit
| Nama | Cambridge University Press |
| Kota | New York |
| Tahun | 2021 |
Sirkulasi
| Harga sewa | IDR 0,00 |
| Denda harian | IDR 0,00 |
| Jenis | Non-Sirkulasi |
