Advances in Embedded and Fan-Out Wafer Level Packaging Technologies
Beth Keser, Steffen Kroehnert
Informasi Umum
Kode
21.21.2041
Klasifikasi
621.381 5 - Components and circuits
Jenis
Buku - Elektronik (E-Book)
Subjek
Component And Circuits
No. Rak
Dilihat
216 kali
Informasi Lainnya
Abstraksi
This book consolidates much of the past 15years’ activity within this amazing new field of packaging technology, starting with a “History of Embedded and Fan?Out Packaging Technology” by Michael Töpper et al. of Fraunhofer IZM, followed by “FO?WLP Market and Technology Trends” by E. Jan Vardaman of TechSearch International. Sections are dedicated to chip?first FO?WLP, chip?last FO?WLP, embedded die packaging, material challenges, equipment challenges, and resulting technology fusions.
The chip?first FO?WLP section begins with a chapter on the first chip?first FO?WLP in the market, called eWLB, by Thorsten Meyer of Infineon Technologies and our coeditor Steffen Kroehnert of Amkor Technology Holding B.V. The section continues with the extension of eWLB to package? on?package (PoP) solutions by S. W. Yoon of STATS ChipPAC. Further chip? first FO?WLP chapters include nepes Corporation’s fan?out packaging technology by Jay Kim and Deca Technologies’ M?Series™ technology by Tim Olson et al. A new technology called chip?last, represented by Amkor Technology’s silicon wafer integrated fan?out technology (SWIFT®), is then presented by Ron Huemoeller and Curtis Zwenger
The embedded die packaging section describes the embedding of die using printed circuit board processes and materials technology represented by Schweizer Electronic (i2 Board and p2 Pack) in chapters by Thomas Gottwald et al., J?Devices (fan?out panel?level package [FO?PLP]) by Akio Katsumata et al., and Infineon Technologies (Blade) by Boris Plikat and Thorsten Scharf. This section also includes a novel idea of embedding a die in a silicon wafer by Daquan Yu of Huatian Technology Electronics Co.
Koleksi & Sirkulasi
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Pengarang
| Nama | Beth Keser, Steffen Kroehnert |
| Jenis | Perorangan |
| Penyunting | |
| Penerjemah |
Penerbit
| Nama | John Wiley & Sons |
| Kota | New York |
| Tahun | 2019 |
Sirkulasi
| Harga sewa | IDR 0,00 |
| Denda harian | IDR 0,00 |
| Jenis | Non-Sirkulasi |
