Modeling and Application of Flexible Electronics Packaging
YongAn Huang, Zhouping Yin, Xiaodong Wan
Informasi Umum
Kode
21.21.319
Klasifikasi
621.381 - Electronics
Jenis
Buku - Elektronik (E-Book)
Subjek
Electronic, Printing
No. Rak
Tel-U Gedung Manterawu Lantai 5 : Rak 12b
Tel-U Purwokerto : Rak 6
Dilihat
92 kali
Informasi Lainnya
Abstraksi
This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of the equipment to help readers easily learn how to use it. This book is a valuable resource for scholars and graduate students in the research field of microelectronics.
Koleksi & Sirkulasi
Tersedia 1 dari total 1 Koleksi
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Pengarang
| Nama | YongAn Huang, Zhouping Yin, Xiaodong Wan |
| Jenis | Perorangan |
| Penyunting | |
| Penerjemah |
Penerbit
| Nama | Springer Singapore |
| Kota | |
| Tahun | 2019 |
Sirkulasi
| Harga sewa | IDR 0,00 |
| Denda harian | IDR 0,00 |
| Jenis | Non-Sirkulasi |
